JPH0246076Y2 - - Google Patents

Info

Publication number
JPH0246076Y2
JPH0246076Y2 JP1983125489U JP12548983U JPH0246076Y2 JP H0246076 Y2 JPH0246076 Y2 JP H0246076Y2 JP 1983125489 U JP1983125489 U JP 1983125489U JP 12548983 U JP12548983 U JP 12548983U JP H0246076 Y2 JPH0246076 Y2 JP H0246076Y2
Authority
JP
Japan
Prior art keywords
conductor
conductor layer
shield structure
frequency circuit
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983125489U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6033496U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12548983U priority Critical patent/JPS6033496U/ja
Publication of JPS6033496U publication Critical patent/JPS6033496U/ja
Application granted granted Critical
Publication of JPH0246076Y2 publication Critical patent/JPH0246076Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP12548983U 1983-08-15 1983-08-15 シ−ルド構造 Granted JPS6033496U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12548983U JPS6033496U (ja) 1983-08-15 1983-08-15 シ−ルド構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12548983U JPS6033496U (ja) 1983-08-15 1983-08-15 シ−ルド構造

Publications (2)

Publication Number Publication Date
JPS6033496U JPS6033496U (ja) 1985-03-07
JPH0246076Y2 true JPH0246076Y2 (en]) 1990-12-05

Family

ID=30285683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12548983U Granted JPS6033496U (ja) 1983-08-15 1983-08-15 シ−ルド構造

Country Status (1)

Country Link
JP (1) JPS6033496U (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998002025A1 (fr) * 1996-07-10 1998-01-15 Hitachi, Ltd. Carte a circuit a basse emissivite et connecteur de cable a basse emissivite

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6343279U (en]) * 1986-09-08 1988-03-23
JP5601325B2 (ja) * 2009-09-01 2014-10-08 日本電気株式会社 通信システム
JP5950617B2 (ja) * 2012-02-22 2016-07-13 三菱電機株式会社 シールド構成体及び電子機器
JP6070977B2 (ja) * 2012-05-21 2017-02-01 日本精機株式会社 電子回路装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59202695A (ja) * 1983-05-04 1984-11-16 松下電器産業株式会社 制御回路基板の保持装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998002025A1 (fr) * 1996-07-10 1998-01-15 Hitachi, Ltd. Carte a circuit a basse emissivite et connecteur de cable a basse emissivite

Also Published As

Publication number Publication date
JPS6033496U (ja) 1985-03-07

Similar Documents

Publication Publication Date Title
US5012387A (en) Printed circuit board with heat dissipating device
US6407340B1 (en) Electric conductor with a surface structure in the form of flanges and etched grooves
US5236736A (en) Method for manufacturing an electromagnetic wave shield printed wiring board
JPH0246076Y2 (en])
JP2000173824A (ja) 電子部品
US6248247B1 (en) Method of fortifying an air bridge circuit
EP1289352A2 (en) High-frequency circuit device and method for manufacturing the same
JPH1131891A (ja) プリント基板の保持方法および保持構造
JP2775809B2 (ja) 半導体チップキャリア
JP4459360B2 (ja) 回路基板およびその製造方法
JPS6482595A (en) Printed wiring board
JPH0747897Y2 (ja) プリント基板
JPH06204628A (ja) プリント配線板
JP3928152B2 (ja) プリント配線板
JPS6240438Y2 (en])
JPS6214717Y2 (en])
JPH0741161Y2 (ja) 混成集積回路
KR100275376B1 (ko) 다층회로기판
JPH09232716A (ja) プリント基板の電流容量向上方法
JPH0555421A (ja) 混成集積回路装置
JPH0230843Y2 (en])
JP2024128157A (ja) 配線回路基板およびその製造方法
JPH024143B2 (en])
JP2764992B2 (ja) 多層プラスチックチップキャリアの切断加工方法
JPH01160202A (ja) 配線板の製造法